Metallized Ceramic Insulator for Vacuum Breaker

In order to achieve welding between ceramic and metal, the ceramic surface must be firmly glued to a layer of metal film, the ceramic metal. The ceramic surface of the metal, making it not only has the characteristics of ceramics, but also has properties of a composite material of metal, while the surface of ceramics can also be used in ceramic metal metal seal area. Our existing technics include: Be silver, molybdenum and manganese method, gold-plated law, tin law, law and other nickel metal ceramic technology, according to customer requirements for ceramic metal processing.

1. Advanced ceramics - Change the world!
Low density
High hardness
High mechanical strength
Dimensional stability (specific stiffness)
Resistance to wear
Resistance to corrosion (resistance to chemical attack)
Weathering resistance
High working temperature
Low or high thermal conductivity
Good electrical insulation
Dielectric and ferroelectric properties

2. Why metallize the ceramic?

Ceramics are usually non-conductive insulators. In order to transport electrons in a specific manner or prepare the ceramic for a solder/braze attach the substrate is generally coated via a screen-printer, lathe, automatic dispenser, spin-coater, etc. After metallization and nickel plating, the ceramic is ready to be soldered into a circuit or package. Active metal brazing makes it possible to join ceramic and other materials without the metallization step. Active metal brazing is very robust, creates vacuum tight joints and has proven very effective over the years. Active metal brazing is done in a vacuum environment and there are some limitations to its application. Conventional brazing, on the other hand, requires metallization because without the metallized layer there will be no adhesion of the molten solder/braze material and there will be no practical joint formed. Here is a simple experiment - drop molten solder (AgSn works well) onto a bare ceramic piece. Note the adhesion of ceramic to metal and vice versa.

3. Applications and joining types:

3.1 for the skeleton of the inductor, confers high-Q inductors, high frequency, the fine chip and other integrated features, ingredients: Alumina (AL203) content ≥ 92%, the metal parts of the bottom electrode for the AG-Pd (AG-Pd), or molybdenum manganese (Mo-Mn), the middle layer of nickel, tin or gold plating for the outermost. Colors in white, with a small amount of black.

3.2 as a micro-chip transformer base and the base of power inductors, ingredients: Alumina (AL203) content ≥ 95%, the bottom electrode metal parts for the silver (AG), the middle layer of nickel, the outer layer Tin or gold plated. Color is white

3.3 used in making porcelain control, surge arresters, surge arresters with special insulation, high temperature, air tightness, heat dissipation, high mechanical strength and the harsh working environment of the high stability and other characteristics, you can use a variety of hard solder gold, silver, copper, nickel and other good fiber welding